OGP SERIE ON BOARD PLATE OG-

Eigenschaften

OGP solves contact failure problems caused by solder flux.
Reliable contact is provided at FG reinforcement of PC board.

Material

Brass (OGP-3216/Au plating,OGP-4520/Sn reflow plating)

ON-BOARD PLATE / OGP

OGP configuration ensures reliable contact.

Part No.	Material	Height
OGP-3216	Brass (Au plating)	0.3 mm
OGP-4520	Brass (Sn reflow plating)	0.15 mm