OGP SERIE ON BOARD PLATE OG-

Eigenschaften
  • OGP solves contact failure problems caused by solder flux.
  • Reliable contact is provided at FG reinforcement of PC board.
Material
  • Brass (OGP-3216/Au plating,OGP-4520/Sn reflow plating)

ON-BOARD PLATE / OGP

OGP configuration ensures reliable contact.

Part No.MaterialHeight
OGP-3216Brass (Au plating)0.3 mm
OGP-4520Brass (Sn reflow plating)0.15 mm