OGP SERIES / ON BOARD PLATE

OGP configuration ensures reliable contact

Features
  • OGP solves contact failure problems caused by solder flux.
  • Reliable contact is provided at FG reinforcement of PC board.
  • Eliminates continuity failure caused by pattern scraping between a PCB and pogo pins and a PCB and a metal plate.
  • OGP-2520 is 40 % or more downsized from OGP-4520. (Product size: 2.5 mm)

ON-BOARD PLATE/OGP-2520 ,-3216, -4520

OGP solves contact failure problems caused by solder flux.

Part No.MaterialHeight
OGP-2520Brass (Sn reflow plating)0.15 mm
OGP-3216Brass (Au plating)0.3 mm
OGP-4520Brass (Sn reflow plating)0.15 mm

Katalog OGP-Serie