OGP SERIES / ON BOARD PLATE

OGP configuration ensures reliable contact

Features

  • OGP solves contact failure problems caused by solder flux.
  • Reliable contact is provided at FG reinforcement of PC board.
  • Eliminates continuity failure caused by pattern scraping between a PCB and pogo pins and a PCB and a metal plate.
  • OGP-2520 is 40 % or more downsized from OGP-4520. (Product size: 2.5 mm)

ON-BOARD PLATE／OGP-2520 ,-3216, -4520

OGP solves contact failure problems caused by solder flux.

Part No.MaterialHeight
OGP-2520Brass (Sn reflow plating)0.15 mm
OGP-3216Brass (Au plating)0.3 mm
OGP-4520Brass (Sn reflow plating)0.15 mm
Dimensionen Zeichnung OGP
OGP Resistance measurement results
Anwendungsbeispiel OGP

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Data sheet with all relevant information on dimensions, material, and electrical properties. Ideal for design, selection, and comparison.

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Further data sheets, test reports, and 3D drawings can be found in the download area of Kitagawa Industries.

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