OGP SERIES / ON BOARD PLATE

OGP configuration ensures reliable contact

Features
  • OGP solves contact failure problems caused by solder flux.
  • Reliable contact is provided at FG reinforcement of PC board.
  • Eliminates continuity failure caused by pattern scraping between a PCB and pogo pins and a PCB and a metal plate.
  • OGP-2520 is 40 % or more downsized from OGP-4520. (Product size: 2.5 mm)

ON-BOARD PLATE/OGP-2520 ,-3216, -4520

OGP solves contact failure problems caused by solder flux.

Part No.MaterialHeight
OGP-2520Brass (Sn reflow plating)0.15 mm
OGP-3216Brass (Au plating)0.3 mm
OGP-4520Brass (Sn reflow plating)0.15 mm

Katalog OGP-Serie

Here you have the possibility to download data sheets, test reports and 3D drawings from the homepage of Kitagawa Industries Co., Ltd.

Please note that you are leaving www.kitagawa.de and we do not assume any warranty. The data protection conditions may differ from those of the EU.

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