CPLK / WÄRMELEITPAD, SILIKONFREI
Dual-Funktions-Rauschunterdrückungs-Thermopad.
Dual-Funktions-Rauschunterdrückungs-Thermopad.
CPLK / WÄRMELEITPAD, SILIKONFREI
Dual-Funktions-Rauschunterdrückungs-Thermopad.
| Test type | Unit | Standard | CPLK-F |
|---|---|---|---|
| Thermal Conductivity | W /m·K | JIS R 2616 (Hot wire method) | 2.0 |
| Thermal Conductivity | W /m·K | ISO22007-2 (Hot Disc method) | 1.4 |
| Color | − | − | Purple |
| Thickness | mm | − | 1.0/ 1.5/ 2.0 |
| Specific Gravity | − | JIS Z 8807 | 2.0 |
| Hardness | ASCER C | JIS K 7312 | 30 |
| Hardness | Shore 00 | ASTM D 2240 | 60 |
| Tensile strength | MPa | JIS K 6251 | 0.39 |
| Elongation rate | % | JIS K 6251 | 9.1 |
| Volume Resistivity | Ω·cm | JIS K 6911 compliant | 1.0x1011 |
| Breakdown voltage | kV/mm | JIS C 2110-1 compliant | 6.6 |
| Withstanding voltage | kV/mm | JIS C 2110-1 compliant | 3.0 |
| Dielectric constant | 1 MHz | Company standard | 5.40 |
| Loss tangent | 1 MHz | Company standard | 0.003 |
| Fammability | − | V-0 equivalent | V-0 |
| Operating temp | ̊C | − | -40∼125 |

