CPVG CollprovideTM / Single-liquid thermal putty designed for dispensing
CPVG / COOLPROVIDETM
Silicone-free, single-liquid, no-drip thermal putty
Features
- Single liquid putty does not drip even when thickly coated.
- Useful to fill gaps between heat spreaders and ICs of various heights. CPVG-30： GAP １ｍｍ or less
- Putty TIM applies very low force after compression. (10% or less as compared to thermal pads)
- Silicone-free TIM generates no siloxane gas and has low oil bleeding.
Ausführungen
| Test type | Unit | Standard | CPVG-30 |
|---|---|---|---|
| Thermal Conductivity | W /m·K | SO22007-2 (Hot Disc method) | 3.0 |
| Thermal resistance / t1.0mm | ℃/W | ASTM D5470 | 0.33 |
| Thermal resistance / t0.3mm | ℃/W | ASTM D5470 | 0.08 |
| Thermal resistance / t0.1mm | ℃/W | ASTM D5470 | 0.01 |
| Color | − | − | White |
| Specific Gravity | − | JIS Z 8807 | 2.90 |
| Breakdown voltage | kV/mm | JIS K 6911compliant | 8 |
| Volume Resistivity | Ω·cm | JIS K 6911 compliant | 1.0x109 |
| Relative permittivity 500MHz | − | Company standard | 8.98 |
| Relative permittivity 1GHz | − | Company standard | 8.88 |
| Fammability | − | UL94 | Equivalent to V-0 |
| Operating temp | ̊C | − | -40∼125 |
Application videos
