CPVG / liquid type
CPVG
Silicone-free, single-liquid, no-drip thermal putty
Features
- Thermal putty does not drip even when thickly applied.
- Extremely useful in filling gaps with varying component heights. CPVG-30： GAP 1mm or less CPVG-50 (Under development): GAP 2 mm or less
- Very little compressive force on sensitive IC components and PCBs.
- No pre-mixing required! Putty is supplied ready to dispense, automated dispensing possible.
- Silicone-free type generates no siloxane gas and oil bleeding is reduced.
Ausführungen
| Test type | Unit | Standard | CPVG-30 | CPVG-50 |
|---|---|---|---|---|
| Thermal Conductivity | W /m·K | SO22007-2 (Hot Disc method) | 3.0 | 5.0 |
| Thermal resistance / t1.0mm | ℃/W | ASTM D5470 | 0.33 | 0.19 |
| Thermal resistance / t0.3mm | ℃/W | ASTM D5470 | 0.08 | 0.05 |
| Thermal resistance / t0.1mm | ℃/W | ASTM D5470 | 0.01 | 0.00 |
| Color | − | − | Gray | Blue |
| Specific Gravity | − | JIS Z 8807 | 2.90 | 3.20 |
| Hardness | ASCER C | JIS K 7312 | 8 | 8 |
| Breakdown voltage | kV/mm | JIS K 6911compliant | 8 | 12 |
| Volume Resistivity | Ω·cm | JIS K 6911 compliant | 1.0x109 | 1.0x109 |
| Relative permittivity 500MHz | − | Company standard | 8.98 | 13.47 |
| Relative permittivity 1GHz | − | Company standard | 8.88 | 13.58 |
| Fammability | − | UL94 | Equivalent to V-0 | Equivalent to V-0 |
| Operating temp | ̊C | − | -40∼125 | -40∼125 |
Application videos
