SIDE CONTACT / OGSC-(T)(B)-302020
Side contact for horizontal grounding.
OGSC-(T)(B)-302020 / On Board Side Contact
Side contact for perpendicular Grounding.Ausführungen
Features
- Ideal for applications where standard grounding between parallel boards/chassis is not possible.
- Due to low profile design (2mm), it's suitable for small electronic devices
| Item | OGSC-T-302020 | OGSC-B-302020 |
|---|---|---|
| Applications | Ground contact for SMD | Ground contact for SMD |
| Material | Corson alloy (t0.08mm) | Corson alloy (t0.08mm) |
| Surface treatment | SN reflow plating (Underlying Cu plating) | SN reflow plating (Underlying Cu plating) |
| Recommended operating temperature ℃ | -40 ∼ 125 | -40 ∼ 125 |
| Compression range (mm) | -0.3 ∼ 1.0 | -0.3 ∼ 1.0 |
| Initial resistance (Ω) | ≦ 0.05 | ≦ 0.05 |
| Initial compression force (N) | 0.2 ∼ 3.1 | 0.4 ∼ 3.0 |
Download
Data sheet with all relevant information on dimensions, material, and electrical properties. Ideal for design, selection, and comparison.
Further data sheets, test reports, and 3D drawings can be found in the download area of Kitagawa Industries. Please note that you are leaving www.kitagawa.de. We accept no liability for external content. Applicable data protection regulations may differ from EU requirements.
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