SIDE CONTACT / OGSC-(T)(B)-302020
Side contact for perpendicular Grounding.
OGSC-(T)(B)-302020 / ON BOARD SIDE CONTACT
Side contact for perpendicular Grounding.
Features
- Ideal for applications where standard grounding between parallel boards/chassis is not possible.
- Due to low profile design (2mm), it's suitable for small electronic devices
Ausführungen
| Item | OGSC-T-302020 | OGSC-B-302020 |
|---|---|---|
| Applications | Ground contact for SMD | Ground contact for SMD |
| Material | Corson alloy (t0.08mm) | Corson alloy (t0.08mm) |
| Surface treatment | SN reflow plating (Underlying Cu plating) | SN reflow plating (Underlying Cu plating) |
| Recommended operating temperature ℃ | -40 ∼ 125 | -40 ∼ 125 |
| Compression range (mm) | -0.3 ∼ 1.0 | -0.3 ∼ 1.0 |
| Initial resistance (Ω) | ≦ 0.05 | ≦ 0.05 |
| Initial compression force (N) | 0.2 ∼ 3.1 | 0.4 ∼ 3.0 |
Catalogue OGSC-(T)(B)-302020
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