• The two-layer structured putty can be handled in the same way as a pad.
  • Has a thermal conductivity of 3.0W/m・K, which is 2.1 times higher than the existing product.
  • Because of non-silicon material, siloxan is not contained.
  • With excellent flexibility and stress relaxation, the assembled pad can lower the load on heating elements and PCBs.
  • Recommended operating temperature is -40°C to +125°C .
  • Oil blead is less, compared with silicone type.

COOLPROVIDE / CPVP-30-F Silicone free, low-hardness, high-thermally conductive pad (3W/m・K)

Test typeUnitStandardCPVP-30-F
Thermal ConductivityW / m*kJIS R 2616 (Hot wire method)3.0
Color--Green / White
Thicknessmm-1.0 / 1.5 / 2.0 / 3.0 / 4.0
HardnessASCER CJIS K 73127 (low hardness layer)
Volume ResistivityΩ・cmJIS K 6911 compliant1.0×1011
Flammability-UL94V-0 equivalent
Operating temp.°C--40 ~ 125

Catalogue CPVP