COOLPROVIDE / CPVP-30-F Silicone free, low-hardness, high-thermally conductive pad (3W/m・K)
CPVP-30-F / COOLPROVIDE
Features
- The two-layer structured putty can be handled in the same way as a pad.
- Has a thermal conductivity of 3.0W/m・K, which is 2.1 times higher than the existing product.
- Because of non-silicon material, siloxan is not contained.
- With excellent flexibility and stress relaxation, the assembled pad can lower the load on heating elements and PCBs.
- Recommended operating temperature is -40°C to +125°C .
- Oil blead is less, compared with silicone type.
Material
Ausführungen
| Test type | Unit | Standard | CPVP-30-F |
|---|---|---|---|
| Thermal Conductivity | W / m*k | JIS R 2616 (Hot wire method) | 3.0 |
| Color | - | - | Green / White |
| Thickness | mm | - | 1.0 / 1.5 / 2.0 / 3.0 / 4.0 |
| Hardness | ASCER C | JIS K 7312 | 7 (low hardness layer) |
| Volume Resistivity | Ω・cm | JIS K 6911 compliant | 1.0×1011 |
| Flammability | - | UL94 | V-0 equivalent |
| Operating temp. | °C | - | -40 ~ 125 |
