CPVG / Thermal Interface Paste

One-component, non-drip thermal interface paste

Features

  • The silicone-free, one-component thermal interface paste is designed to reliably fill gaps between heat sinks and electronic components (ICs) of varying heights. Its non-sag, non-drip consistency ensures easy and precise dispensing using either a manual cartridge gun or an automatic dispenser. No curing process is required, as the pre-crosslinked material provides excellent structural stability without the need for heat or UV exposure. After compression, the paste exerts only minimal stress on components—less than 10% of the force generated by conventional thermal pads.
  • Key Features One-component, non-drip thermal interface paste Easy and precise dispensing No heat or UV curing required Low compression force to protect sensitive components Silicone-free – no siloxane gas generation Reduced oil bleed Suitable for manual and automated dispensing systems

CPVG-30 / CPVG-50 Thermal Interface Paste

Test typeUnitStandardCPVG-30-CCPVG-50-P
Thermal ConductivityW /m·KISO22007-2 (Hot Disc method)3.05.0
Thermal resistance t1.0mm/t0.3mm/t0.1mm℃/WASTM D54700.33/0.08/0.010.19/0.05/-
ColorWhiteWhite
Specific GravityJIS Z 88072.93.2
Viscsity 0.5[1/s] / 1.0[1/s] / 10rpmPa・sASTM D1824 compliant3300 / 2500 / 600− / − / 1000
Recommended Thicknessmm0.1 ~ 1.00.3 ~ 2.0
Volume Resistivity Ω・cmJIS K 6911 compliant1.0×1091.0×109
Breakdown voltagekV/mmJIS K 6911 complaint83
Dielectric constant / 1 MHzCompany standard9.2513.2
Loss tangent / 1MHzCompany standard0.060.07
FammabilityUL94V-0 equivalentV-0 equivalent
Operating temp̊C-40∼125-40∼130
Supply formatCartridge 330 ml20L Pail (Net ciontent: 17kg)

Download

Data sheet with all relevant information on dimensions, material, and electrical properties. Ideal for design, selection, and comparison.

Further data sheets, test reports, and 3D drawings can be found in the download area of Kitagawa Industries.

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